Hey,
just desoldered my microphone from the bottom module.
the (very thin) pcb is glued into the plastic case of the module. But with a heatgun the glue softened and you can pull it out.
After that I put my heatgun on 380°C and desoldered the mic. I coverd the surrounding parts with kapton tape.
But I ripped one half of one solderpad off the pcd(see picture, top right pad). The trace from that pad seemed to be connected to a via next to it.
That was written on my mic:
S1263
2779
unfortunately I dropped the mic on the floor and couldn’t find it easily 
I will search it next week probably… 
In the next days I will post small sketch of the dimension of the mic-footprint.
cheers,
Patrick