I remember such batteries for older HTC and Samsungs They came with a new back cover and were very popularā¦
I had to research for a picture because I couldnāt really imagine how this would look.
Here it is:
This one should be obvious: Future updates to the modules with (then) current components (i.e. better camera, faster processor, more RAM, etc.)
You are right, thatās probably obvious, but thanks for pointing it out.
I also added E-reader display and solar panel for power saving purposes.
Maybe a back with a built in flip-cover.
Would an infrared emitter/sensor back cover be possible? You could use your phone for TVs, sound systems and other stuff
It could be nice if there are an alternative mainboard (the central part of the phone) with a totally open chipset. I am sure that this kind of chipset could be lesser powerful if compared to a closed one, but I think that it could be very interesting for a lot of (advanced) users.
@deedend Are you talking about open hardware or about hardware that supports open/free software?
In the first case do you know of a open hardware chipset? In the second case: We donāt know yet how open/closed the source code for the FP2 will be. There is a chance that we will be able to install all kinds of FOSS operating systems on the FP2, so letās wait until we know more.
@huskers Sorry I meant to answer you sooner: Are you talking about a remote-control with real keys on the back cover? Wouldnāt it be better/easier to simply add a infrared sensor and make an app that can be used as a remote control?
Thatās what I meant. Didnāt think about the exact meaning of the English āremote controlā when I wrote that post
[quote=āpaulakreuzer, post:24, topic:6846, full:trueā]
@deedend Are you talking about open hardware or about hardware that supports open/free software?
In the first case do you know of a open hardware chipset? In the second case: We donāt know yet how open/closed the source code for the FP2 will be. There is a chance that we will be able to install all kinds of FOSS operating systems on the FP2, so letās wait until we know more.[/quote]
I refer at this answer of Paul Kocialkowski at an user that ask him if there will be a Replicant version for Fairphone; the alternatives could be i.MX6, OMAP4/5 or Allwinner.
I also would appreciate if there will be a fairphone variant with a hardware keyboard (like a integrated slider) in future. Itās much more convenient than a external bluetooth keyboard (or any other wireless connectivity). Especially on travel itās essential.
I have the feeling that we donāt nearly exploit the full creative potential that the modularity and expandability of Fairphone 2 offer.
Donāt get me wrong: I like the wishlist above and see many sensible wishes. However I deem all of them standard or even boring. Are we not able to come with more creative stuff?
Like what? A kitchen machine module? A lightsaber module? A teleportation module?
If I knew, I would suggest something awesome and not whine.
This seems like a very good start. Maybe a little impractical though
Pretty easy for me.
Module list
- A connector that can be easily exchanged (āUSB-C moduleā)
- A camera, the only thing with a blob from f#@!!#ing Sony, but they work well. I think this is the only thing with a blob really needed on a smartphone due to patents.
- If needed (I wonāt) a new chip from the SDxxx range, but I donāt think that is necessary.
Done.
@Paulkreuzer: You seem to have investigated a lot about this: What IS the Status of the exchangability of the FP2 components? When in 2018 a 20MP camera is standard, might it be possible that one can be bought? More important: might the mainboard&processor be exchangeable for a newer one (I accept that it would have to be one from FAIRPHONE)? IMO this is the most important reason why people abandon their old smartphone.
Actually I donāt know anything more than what information the Fairphone team released on the blog. All of this here is just speculation and wishing. But I guess in theory a better camera and an upgraded mainboard is possible and probably something Fairphone are planning, but weāll only know for certain when they announce something.
Iām not Paul, but currently the Fairphone project uses Qualcomm SoCs (āSnapdragonā). These SoCs are a bit open and they allow upgrades (801 ā¦ 820) with new base boards.
There are certain kinds of bus systems (standardized by the big companies) connecting the different (few) parts of smartphone hardware (display, wifi, cameras). The most hurtful thing is the so called āblobā firmware/software needed to make the different parts of the cellphone work together.
Most often those are not updated for new APIs (in Android) once new hardware is manufactured and needs to be sold. Although a lot of code is open ā¦ it ages (linux kernel and android are not syncāed up for the SoC) and other parts that are not open are also not updated. So ā¦ although the hardware could run more up to date software ā¦ it is turned to e-waste because the supply chain (SoC, camera, ā¦) does not support the the upgrade for newer code any longer and (and this is the worst part) also does not allow others to code for their hardware.
Iām sure fairphone developers could write more about this issues, but I never read much about this, only hints.
I have high hopes that the fairphone project will fix a few of these issues. But I donāt think they have enough manpower for this. They right now only focus on getting ābetterā materials (fair source materials, better safety&health and payment for the workers) not so much on the software/hardware side.
But right now ā¦ nothing new was announced. But it was promised that after this weekend we will know more about how open the software will be (see the blog). So keep checking the website!