A lot to do for FP3: mains cost, RAM, storage, IP68, cover cost, thickness, weight

[Johannes]

If you’re asking that question, you may also be interested in this topic:

Fairphone 3 -- Hardware and obsolecence discussion

“According to van Abel, the work on the Fairphone 3 will start in January [2016?], and in the future new Fairphones will enter the market every two to three years.” It looks like there is already a FP3 in the discussion. I think I will skip the FP2, but I would really like to see a more open OEM/SoC choosing process this time. Would this be possible? What are the plans for this so far? Or is it already decided that the FP project will stick with the same OEM & QC?

Part of the discussion there already goes into whether there should be ‘refreshes’ of FP2 modules, or whether there needs to a fundamentally different design iteration.